During the driving process , many novices are afraid of the car. Especially when the car is on a narrow road, the novice tends to feel nervous. After a rush, there will be flameouts, stoppages, and even the two cars scratching and colliding with each other. , Or touch the roadside non-motor vehicles, pedestrians and roadside isolation facilities.
Experienced aerial vehicles and old drivers are recruiting strokes. In order to avoid the above situations, the novice must psychologically overcome the nervous and scared feelings, and easily face the car. The correct car must be prepared in advance to avoid the mentality of the car. Panic and operational hurry.
To do this, you will want to see two counts and three slows before your vehicle: At first glance, you will see the model, speed, and loading of the car, the width and solid condition of the road ahead, the pedestrians and vehicles along the road, and the on-street parking. And obstacles, etc.; second calculation, through the observation and comparison, to estimate the approximate location of the two vehicles at the time of intersection, the road situation, in order to leave a suitable horizontal safety interval; three slow, that is, when the car will slow down, approaching Poor conditions in the meeting should be to control the speed, not blindly meet, if necessary, should be the first stop. In addition, the car will also pay attention to the rules of the transfer, and timely and reasonable to allow line. At night there is no street lighting or poor lighting on the road, will When driving the vehicle, switch off the high beam and switch to the low beam.
Cleaning Solution For Semiconductor
Cleaning runs throughout the semiconductor manufacturing. The cleaning of semiconductors runs through the entire semiconductor process. From the silicon wafer manufacturing, it is necessary to clean the polished silicon wafer to remove surface contaminants, remove photoresist, wet etching, CVD, etc. in the chip preparation, and then to the final material quality inspection. Every step needs to be cleaned to ensure that the next step is free from impurities and maintain the yield of the product. At the same time, as the chip process continues to shrink, the number of cleanings required is increasing. According to statistics, the number of cleaning processes accounts for one-third of the entire chip manufacturing process, and is an important part of chip manufacturing. Very low surface tension and viscosity, it can be well dispersed and spread into various gaps, with good scouring and wetting cleaning effect.
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